Redefining Customer Service
Customer Support | Phone: 717-558-5975

Guide to PCB CAF Issues

Guide to PCB CAF Issues Conductive Anodic Filament (CAF) failure is a common and growing concern in the electronics industry. It has the potential to be a catastrophic failure mode, where a conductive salt containing copper can form within printed circuit boards (PCBs). It’s a type of electrochemical migration that grows along the epoxy or glass interface from the anode to the cathode sub-surface. Electrochemical migration is a process in which conductive metal filaments grow across a dielectric material. What Is Conductive Anodic Filament Formation? CAF formation is the term for the process by which CAF grows. CAF formation is described as a two-step process: First, the resin glass interface degrades, which is believed to be reversible. The second stage, the electrochemical migration, is not reversible. CAF failure refers to the electrical failure that results from CAF formation. The failure occurs when the CAF grows from the anode to the cathode.

Read more

PCB Glossary

  • Tooling Holes

    The general term for holes placed on a PCB or a panel of PCBs for registration and hold-down purposes during the manufacturing process. Also known as Fabrication Hole, Pilot Hole, or Manufacturing Hole.