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Guide to PCB Gold Fingers

In today’s computerized and mobile-activated world, signals are sent between numerous devices. For each command to be enacted, communication must be made between two or more circuit boards. None of this would be possible without gold fingers, which serve as the connecting contacts between motherboards and components like graphics or sound cards. The technology used to transmit these signals and commands is a huge leap forward from earlier electronics, which typically consisted of separate modules that were difficult to bring into communication with one another. With gold fingers, the processes of one circuit board are immediately read by the main processing board. The processes associated with this advanced technology extend across all corners of the public and private sectors. In the world of manufacturing, signals are sent between various devices and machines to enact a series of processes, many of which could not be carried out by human hands. At

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PCB Ionic Contamination Testing

PCB Ionic Contamination Approximately 15% of PCBA failures occur due to contamination. Ionic contamination can cause multiple issues that lead to defective PCBs. Testing the bare board for ionic contamination before completing assembly reduces the risk of defects caused by contaminants. This guide will describe ionic contamination, the problems it causes and how manufacturers conduct ionic contamination testing. What Is Ionic Contamination in PCBs? Ionic contamination happens when ionic residues that interfere with reliability and functionality remain on a complete PCB. An ionic residue contains atoms or molecules that become conductive when in a solution. Exposure to moisture makes ionic residues disassociate into negatively or positively charged elements, changing the solution’s overall conductivity. A PCB can also have nonionic contamination, which involves nonionic residues. Nonionic residues don’t have conductive properties, so they can usually remain on the PCB after production and assembly. Therefore, most manufacturers focus on ionic contamination when examining

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The Value of a Global Sourcing Partner

Introduction In today’s highly competitive environment, global sourcing is no longer a competitive strategy; it is a standard practice. Understanding what it takes to truly do this successfully separates the industry leaders from the pretenders. The Asian Shift When the “Asian shift” in PCBs really began to take hold a few decades ago, it began with Japan, which was soon replaced by Taiwan, which was finally replaced by China. As this dynamic continues, one thing is certain: This international sourcing evolution will continue. To stay in the game, companies need to develop a global sourcing strategy to remain relevant and sustainable. The challenges of developing a robust domestic PCB supply chain is daunting enough but moving onto the international stage presents a whole new degree of difficulty that most companies are not equipped to manage. Typically, only the biggest companies have the resources to do this on their own. Identifying

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Guide to PCB CAF Issues

Guide to PCB CAF Issues Conductive Anodic Filament (CAF) failure is a common and growing concern in the electronics industry. It has the potential to be a catastrophic failure mode, where a conductive salt containing copper can form within printed circuit boards (PCBs). It’s a type of electrochemical migration that grows along the epoxy or glass interface from the anode to the cathode sub-surface. Electrochemical migration is a process in which conductive metal filaments grow across a dielectric material. What Is Conductive Anodic Filament Formation? CAF formation is the term for the process by which CAF grows. CAF formation is described as a two-step process: First, the resin glass interface degrades, which is believed to be reversible. The second stage, the electrochemical migration, is not reversible. CAF failure refers to the electrical failure that results from CAF formation. The failure occurs when the CAF grows from the anode to the cathode.

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PCB Glossary

  • V-Scoring

    Rather than completing a route path around the board edge, the edges are “scored” to allow breaking boards apart after assembly. This is another way to palletize / panelize the boards (see Tab Routing).