Capabilities

MCL Domestic and Offshore PCB Capabilities

Choosing MCL as your circuit board manufacturer has its benefits. As a member of the MCL family, you’ll experience rapid quote response, flexible lead times, technical support, and engineering services from a leading supplier who is on the cutting-edge of technology offering a variety of PCB solutions – everything you need and want from a PCB supplier.

We offer a wide range of printed circuit board manufacturing capabilities that are in-line with your PCB needs.  In order to meet the needs of our diverse customer pool, MCL has both strategic manufacturing partners domestically and overseas so that we are expertly positioned to deliver the right board with the right specifications.

Why Use MCL for Your Offshore PCB Manufacturing Services?

Offshore PCB manufacturing services from Millennium Circuits Limited adhere to our industry-leading capabilities and tolerance requirements. We guarantee a high quality of production and engineering  and support services.

By offering PCB offshore services in the United States, we allow customers like you to secure high-quality PCBs at a more affordable rate. In being a strategic partner to our customers, MCL’s motive is to help increase our customers’ competitiveness in their markets through utilizing our experience in custom printed circuit board manufacturing and global logistics.

Regardless of the location of the manufacturing facility, in the USA or offshore, MCL operates quickly and efficiently, taking accountability to build your PCBs to the right specifications and delivering them on-time, strengthening your PCB supply chain.

Millennium Circuits is your go-to source for all your PCB needs. Contact us today to learn more about domestic and offshore printed circuit boards, plus get your free quote.

View Our Technology Roadmap


Capabilities

  • Quick Turn
  • Prototype Quantities
  • Production Quantities
  • 1 – 44 Layers
  • 35:1 Drill Aspect Ratio
  • Maximum Panel Size – 24″ x 30″
  • Blind / Buried Vias. & Micro Vias
  • Via In Pad with Fill Options
  • (Conductive, Non Conductive, Copper Plug)
  • Controlled Impedance
  • High Copper Thickness

Surface Finish Options

  • Immersion Gold (ENIG)
  • Immersion Silver
  • Immersion Tin
  • ENEPIG
  • HASL
  • Pb-Free HAL
  • OSP
  • Hard Gold
  • Soft Gold
  • Selective Finishes

Base Materials

  • RoHS Compliant Options
  • High Speed Digital Options
  • High Frequency RF Options
  • High Temperature Options
  • Aluminum Clad Options
  • Ceramic Options

Products

  • Rigid
  • Flex
  • Rigid-Flex
  • Hybrid RF Mircowave / Digital
  • Metal Core
  • Aluminum Backed
  • Ceramic Core

Value-Added Services

  • Rapid quote response
  • Lifecycle management – prototypes, managing board revisions and artwork
  • DFM Review & Analysis
  • Panelization
  • Cost consulting
  • Stackup design
  • Surface finish consultation
  • Laminate and raw material consultation

Our Capabilities

You will find options below on our different capabilities when it comes to engineering services, manufacturing abilities, lifecycle management, prototyping, and quick turn services from MCL.

It can be a challenge to find the optimal supplier for PCBs – meeting each and all customers’ expectations and requirements on price, quality, lead times, value-added services, and delivery. MCL is confidant that we meet each and every expectations for each PCB.

Specs and Tolerances

Outer Layer Trace / Space.002″ / .002″
Inner Layer Trace / Space.002′ / .002′
Minimum Drilled Hole.002″
Standard Drilled Hole.008″
Drill Aspect Ratio35:1
Minimum Pad Size.004″
Minimum Feature to Edge.010″
Minimum Core Thickness.001″
Controlled Depth DrillingYES
Sequential LaminationYES

Click here to download!

Technology Roadmap – Millennium Circuits Limited

Product Types

Standard

Premium

Leading Edge

Future

Rigid PCB technologiesYes
Flexible circuitsYes
Rigid-flex circuitsYes
Flex heaters / ribbon cablesYes
Thermal management / LED PCBs Yes
High speed digital PCBs Yes
RF/microwave/mm-wave PCBs Yes

Technologies

Highest layer count24284040
Maximum board thickness (in mils)220235250300
Minimum board thickness (2 layer) (in mils)5432
Thinnest core material (rigid) (in mils)32.521.5
Thickest core material (in mils)125125125125
Largest panel size (in inches)18 by 2424 by 3024 by 3024 by 30
Maximum usable area (in inches)16 by 2222 by 2822 by 2822 by 28
Bow and twist -% (balanced)<0.75%<0.75%<0.75%<0.75%
Minimum copper to edge clearance (in mils)10855
Min. positional tol.-feature to feature (in mils)+/- 5+/- 4+/- 3+/- 2
Layer to layer registration tolerance (in mils)+/- 5+/- 4+/- 3+/- 2
Number of sequential lamination cycles2456
Hole to copper (internal plane layers) (in mils)10765
Drilled hole to drilled hole distance (in mils)141287
Inner layer lines and spaces (1/2 oz.)4322
Inner layer lines and spaces (1/4 oz.)4321.5
Outer layer lines and spaces (1/2 oz. base)4322.5
Outer layer lines and spaces (1/4 oz. base) 4322
Maximum aspect ratio-w/.010" drilled hole 10:120:130:135:1
Smallest drilled thru via 62 mil thick (in mils)8645
Smallest drilled thru via 93 mil thick (in mils)10865
Smallest drilled thru via 115 mil thick (in mils)121086
Min. pad width (in mils)8643
Min. pad spacing (mils)8643
Min. pad pitch (mils) 141086
Pad size over via size -Class 2 (in mils)10864
Pad size over via size -Class 3 (in mils)121088
Antipad over drill size (in mils)201687
Press fit hole tolerance (in mils)+/- 2+/- 2+/-1.5+/- 1
Back drilling tolerance +/- (in mils)10643

High Density Interconnect (HDI)

Smallest laser drilled vias (in mils)4322
Smallest pad size over drilled hole size (in mils)10743
Maximum aspect ratio-microvias0.8:11.2:11.5:12:01
Stacked/Staggered Micro Viasyesyesyesyes
HDI Constructions1+n+12+n+25+n+56+n+6

Soldermask

SMD soldermask web width (in mils) 3223
SMD soldermask clearance over pad (in mils) 4323
Soldermask registration tolerance (using film) 32.522
Soldermask registration tolerance (using LDI) 2.521.51

Controlled Impedance

Impedance control-single ended +/- %10%5%5%3%
Impedance control-edge coupled diff. +/-%10%5%5%3%
Impedance control-broad side differential +/-%10%5%5%3%

Laminate materials

Standard FR4Yes
Lead-free compatible FR4Yes
High speed digital materialsYes
RF / microwave materialsYes
Millimeterwave compatible materialsYes

Thermal management / LED board

Aluminum backed materialsYes
Thermal conductivity of 1.5 W/mKYes
Thermal conductivity of 2.2 W/mKYes
Thermal conductivity of 3.0 W/mKYes
Thermal conductivity of 4.0 W/mKyes
Thermal conductivity of 8.0 W/mKyes

Surface Finishes

ENIG (electroless Ni-immersion gold)Yes
ENIPIG (thin palladium <8 micro inchesYes
ENEPIG (thick palladium up to 24 micro inchesYes
Immersion SilverYes
Immersion TinYes
OSP - lead free compatibleYes
HASL (Tin/Lead) - verticalYes
HASL (lead-free) - verticalYes
Electrolytic hard goldYes

Advanced technologies

Via-in-padYes
Copper plated shut micro viasYes
Single tier cavity designYes
Mixed dielectric designsYes
Edge plating / edge castellationsYes
Wrap plating (blind vias / filled vias)Yes
Laser defined soldermask printingYes
Embedded resistanceYes
Embedded capacitanceYes
Jump scoring capabilitiesYes
ISO-9001:2015Yes
ITAR RegisteredYes

Technology Roadmap – Millennium Circuits Limited | Click here to download!

Contact MCL

Over the years, MCL has developed stringent internal processes and controls that guide how we work. This allows MCL to have a quick quote response and give the utmost attention to detail to your quote and order at all stages.

Contact MCL to discuss what materials and technology we can support and find out what engineering services and lifecycle management options MCL offers that will make buying PCBs seamless. MCL Redefines Customer service for our portfolio of customers on a daily basis. Call us at 717-558-5975 or click here to contact us online to fill the missing link in your supply chain!

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