MCL Domestic and Offshore PCB Capabilities
Choosing MCL as your circuit board manufacturer has its benefits. As a member of the MCL family, you’ll experience rapid quote response, flexible lead times, technical support, and engineering services from a leading supplier who is on the cutting-edge of technology offering a variety of PCB solutions – everything you need and want from a PCB supplier.
We offer a wide range of printed circuit board manufacturing capabilities that are in-line with your PCB needs. In order to meet the needs of our diverse customer pool, MCL has both strategic manufacturing partners domestically and overseas so that we are expertly positioned to deliver the right board with the right specifications.
Why Use MCL for Your Offshore PCB Manufacturing Services?
Offshore PCB manufacturing services from Millennium Circuits Limited adhere to our industry-leading capabilities and tolerance requirements. We guarantee a high quality of production and engineering and support services.
By offering PCB offshore services in the United States, we allow customers like you to secure high-quality PCBs at a more affordable rate. In being a strategic partner to our customers, MCL’s motive is to help increase our customers’ competitiveness in their markets through utilizing our experience in custom printed circuit board manufacturing and global logistics.
Regardless of the location of the manufacturing facility, in the USA or offshore, MCL operates quickly and efficiently, taking accountability to build your PCBs to the right specifications and delivering them on-time, strengthening your PCB supply chain.
Millennium Circuits is your go-to source for all your PCB needs. Contact us today to learn more about domestic and offshore printed circuit boards, plus get your free quote.
Capabilities
- Quick Turn
- Prototype Quantities
- Production Quantities
- 1 – 44 Layers
- 35:1 Drill Aspect Ratio
- Maximum Panel Size – 24″ x 30″
- Blind / Buried Vias. & Micro Vias
- Via In Pad with Fill Options
- (Conductive, Non Conductive, Copper Plug)
- Controlled Impedance
- High Copper Thickness
Surface Finish Options
- Immersion Gold (ENIG)
- Immersion Silver
- Immersion Tin
- ENEPIG
- HASL
- Pb-Free HAL
- OSP
- Hard Gold
- Soft Gold
- Selective Finishes
Base Materials
- RoHS Compliant Options
- High Speed Digital Options
- High Frequency RF Options
- High Temperature Options
- Aluminum Clad Options
- Ceramic Options
Products
- Rigid
- Flex
- Rigid-Flex
- Hybrid RF Mircowave / Digital
- Metal Core
- Aluminum Backed
- Ceramic Core
Value-Added Services
- Rapid quote response
- Lifecycle management – prototypes, managing board revisions and artwork
- DFM Review & Analysis
- Panelization
- Cost consulting
- Stackup design
- Surface finish consultation
- Laminate and raw material consultation
Our Capabilities
You will find options below on our different capabilities when it comes to engineering services, manufacturing abilities, lifecycle management, prototyping, and quick turn services from MCL.
It can be a challenge to find the optimal supplier for PCBs – meeting each and all customers’ expectations and requirements on price, quality, lead times, value-added services, and delivery. MCL is confidant that we meet each and every expectations for each PCB.
Specs and Tolerances
| Outer Layer Trace / Space | .002″ / .002″ |
| Inner Layer Trace / Space | .002′ / .002′ |
| Minimum Drilled Hole | .002″ |
| Standard Drilled Hole | .008″ |
| Drill Aspect Ratio | 35:1 |
| Minimum Pad Size | .004″ |
| Minimum Feature to Edge | .010″ |
| Minimum Core Thickness | .001″ |
| Controlled Depth Drilling | YES |
| Sequential Lamination | YES |
Technology Roadmap – Millennium Circuits Limited
Product Types | Standard | Premium | Leading Edge | Future |
| Rigid PCB technologies | Yes | |||
| Flexible circuits | Yes | |||
| Rigid-flex circuits | Yes | |||
| Flex heaters / ribbon cables | Yes | |||
| Thermal management / LED PCBs | Yes | |||
| High speed digital PCBs | Yes | |||
| RF/microwave/mm-wave PCBs | Yes | |||
Technologies | ||||
| Highest layer count | 24 | 28 | 40 | 40 |
| Maximum board thickness (in mils) | 220 | 235 | 250 | 300 |
| Minimum board thickness (2 layer) (in mils) | 5 | 4 | 3 | 2 |
| Thinnest core material (rigid) (in mils) | 3 | 2.5 | 2 | 1.5 |
| Thickest core material (in mils) | 125 | 125 | 125 | 125 |
| Largest panel size (in inches) | 18 by 24 | 24 by 30 | 24 by 30 | 24 by 30 |
| Maximum usable area (in inches) | 16 by 22 | 22 by 28 | 22 by 28 | 22 by 28 |
| Bow and twist -% (balanced) | <0.75% | <0.75% | <0.75% | <0.75% |
| Minimum copper to edge clearance (in mils) | 10 | 8 | 5 | 5 |
| Min. positional tol.-feature to feature (in mils) | +/- 5 | +/- 4 | +/- 3 | +/- 2 |
| Layer to layer registration tolerance (in mils) | +/- 5 | +/- 4 | +/- 3 | +/- 2 |
| Number of sequential lamination cycles | 2 | 4 | 5 | 6 |
| Hole to copper (internal plane layers) (in mils) | 10 | 7 | 6 | 5 |
| Drilled hole to drilled hole distance (in mils) | 14 | 12 | 8 | 7 |
| Inner layer lines and spaces (1/2 oz.) | 4 | 3 | 2 | 2 |
| Inner layer lines and spaces (1/4 oz.) | 4 | 3 | 2 | 1.5 |
| Outer layer lines and spaces (1/2 oz. base) | 4 | 3 | 2 | 2.5 |
| Outer layer lines and spaces (1/4 oz. base) | 4 | 3 | 2 | 2 |
| Maximum aspect ratio-w/.010" drilled hole | 10:1 | 20:1 | 30:1 | 35:1 |
| Smallest drilled thru via 62 mil thick (in mils) | 8 | 6 | 4 | 5 |
| Smallest drilled thru via 93 mil thick (in mils) | 10 | 8 | 6 | 5 |
| Smallest drilled thru via 115 mil thick (in mils) | 12 | 10 | 8 | 6 |
| Min. pad width (in mils) | 8 | 6 | 4 | 3 |
| Min. pad spacing (mils) | 8 | 6 | 4 | 3 |
| Min. pad pitch (mils) | 14 | 10 | 8 | 6 |
| Pad size over via size -Class 2 (in mils) | 10 | 8 | 6 | 4 |
| Pad size over via size -Class 3 (in mils) | 12 | 10 | 8 | 8 |
| Antipad over drill size (in mils) | 20 | 16 | 8 | 7 |
| Press fit hole tolerance (in mils) | +/- 2 | +/- 2 | +/-1.5 | +/- 1 |
| Back drilling tolerance +/- (in mils) | 10 | 6 | 4 | 3 |
High Density Interconnect (HDI) | ||||
| Smallest laser drilled vias (in mils) | 4 | 3 | 2 | 2 |
| Smallest pad size over drilled hole size (in mils) | 10 | 7 | 4 | 3 |
| Maximum aspect ratio-microvias | 0.8:1 | 1.2:1 | 1.5:1 | 2:01 |
| Stacked/Staggered Micro Vias | yes | yes | yes | yes |
| HDI Constructions | 1+n+1 | 2+n+2 | 5+n+5 | 6+n+6 |
Soldermask | ||||
| SMD soldermask web width (in mils) | 3 | 2 | 2 | 3 |
| SMD soldermask clearance over pad (in mils) | 4 | 3 | 2 | 3 |
| Soldermask registration tolerance (using film) | 3 | 2.5 | 2 | 2 |
| Soldermask registration tolerance (using LDI) | 2.5 | 2 | 1.5 | 1 |
Controlled Impedance | ||||
| Impedance control-single ended +/- % | 10% | 5% | 5% | 3% |
| Impedance control-edge coupled diff. +/-% | 10% | 5% | 5% | 3% |
| Impedance control-broad side differential +/-% | 10% | 5% | 5% | 3% |
Laminate materials | ||||
| Standard FR4 | Yes | |||
| Lead-free compatible FR4 | Yes | |||
| High speed digital materials | Yes | |||
| RF / microwave materials | Yes | |||
| Millimeterwave compatible materials | Yes | |||
Thermal management / LED board | ||||
| Aluminum backed materials | Yes | |||
| Thermal conductivity of 1.5 W/mK | Yes | |||
| Thermal conductivity of 2.2 W/mK | Yes | |||
| Thermal conductivity of 3.0 W/mK | Yes | |||
| Thermal conductivity of 4.0 W/mK | yes | |||
| Thermal conductivity of 8.0 W/mK | yes | |||
Surface Finishes | ||||
| ENIG (electroless Ni-immersion gold) | Yes | |||
| ENIPIG (thin palladium <8 micro inches | Yes | |||
| ENEPIG (thick palladium up to 24 micro inches | Yes | |||
| Immersion Silver | Yes | |||
| Immersion Tin | Yes | |||
| OSP - lead free compatible | Yes | |||
| HASL (Tin/Lead) - vertical | Yes | |||
| HASL (lead-free) - vertical | Yes | |||
| Electrolytic hard gold | Yes | |||
Advanced technologies | ||||
| Via-in-pad | Yes | |||
| Copper plated shut micro vias | Yes | |||
| Single tier cavity design | Yes | |||
| Mixed dielectric designs | Yes | |||
| Edge plating / edge castellations | Yes | |||
| Wrap plating (blind vias / filled vias) | Yes | |||
| Laser defined soldermask printing | Yes | |||
| Embedded resistance | Yes | |||
| Embedded capacitance | Yes | |||
| Jump scoring capabilities | Yes | |||
| ISO-9001:2015 | Yes | |||
| ITAR Registered | Yes |
Technology Roadmap – Millennium Circuits Limited | Click here to download!
Contact MCL
Over the years, MCL has developed stringent internal processes and controls that guide how we work. This allows MCL to have a quick quote response and give the utmost attention to detail to your quote and order at all stages.
Contact MCL to discuss what materials and technology we can support and find out what engineering services and lifecycle management options MCL offers that will make buying PCBs seamless. MCL Redefines Customer service for our portfolio of customers on a daily basis. Call us at 717-558-5975 or click here to contact us online to fill the missing link in your supply chain!