Redefining Customer Service
Customer Support | Phone: 717-558-5975

MCL Domestic and Offshore PCB Capabilities

Offshore PCB CapabilitiesChoosing MCL as your circuit board manufacturer has its benefits. You’ll get our collective 75 years of experience and our promise of excellent customer service. We offer a wide range of printed circuit board capabilities we’re sure will match all of your PCB needs your need with our PCB Offshore Service.

Domestic capabilities ensure that all of your equipment has a tight turnaround and quick shipping options. Whether you’re interested in domestic production or offshore PCB manufacturing services, we’re able to work with you to create a product that will revolutionize your industry.

PCB offshore services from MCL are also a viable option if you need multiple financing options, especially for large orders. Offshoring will require a longer lead time, but quality is never compromised in any MCL production.

Jump To: Capabilities | Specs and Tolerances | Technology Roadmap | Request a Free Quote

Why Use MCL for Your Offshore PCB Manufacturing Services?

Offshore PCB manufacturing services from Millennium Circuits Limited adhere to our industry-leading capabilities and tolerance requirements. We guarantee a high quality of engineering, production and customer service, no matter what avenue you choose to take.

By offering PCB offshore services in the United States, we allow customers like you to secure high-quality PCBs at a more affordable rate. When you put your printed circuit boards offshore, there is no loss of quality or competence. All engineering is checked, all products tested and all compliance met on any and all domestic or offshore manufacturing.

The motto here at Millennium Circuits Limited is “Redefining Customer Service,” and that applies to everything we do. No matter what method of production you choose or financing option you select, MCL is here for you.

We also offer a FREE PCB File Check to ensure that your design is error-free. We encourage you to use this service.

Millennium Circuits wants to be your go-to source for all your PCB needs. Contact us today to learn more about domestic and offshore printed circuit boards, plus get your free quote.


  • Quick Turn
  • Prototype Quantities
  • Production Quantities
  • 2 – 44 Layers
  • 35:1 Drill Aspect Ratio
  • Maximum Panel Size – 24″ x 30″
  • Blind / Buried Vias. & Micro Vias
  • Via In Pad with Fill Options
  • (Conductive, Non Conductive, Copper Plug)
  • Controlled Impedance
  • High Copper Thickness

Surface Finish Options

  • Immersion Gold (ENIG)
  • Immersion Silver
  • HASL
  • Pb-Free HAL
  • OSP
  • Hard Gold
  • Soft Gold
  • Selective Finishes

Read more about PCB Surface Finish Types

Base Materials

  • RoHS Compliant Options
  • High Speed Digital Options
  • High Frequency RF Options
  • High Temperature Options
  • Aluminum Clad Options


  • Rigid
  • Flex
  • Rigid-Flex
  • Hybrid RF/Digital
  • Metal Core
  • Aluminum Backed

Customer Service

  • Concurrent Engineering Solutions
  • Quick Quote Response
  • DFM Review & Analysis
  • Value-Added Engineering Solutions
  • Responsive Service Solutions
  • Regional Field & FAE Support

Specs and Tolerances

Outerlayer Trace / Space .003″ / .003″
Innerlayer Trace / Space .003′ / .002′
Minimum Drilled Hole .004″
Standard Drilled Hole .010″
Drill Aspect Ratio 35:1
Minimum Pad Size .004″
Minimum Feature to Edge .010″
Minimum Core Thickness .002″
Controlled Depth Drilling YES
Sequential Lamination YES

Technology Roadmap – Millennium Circuits Limited

Product TypesStandardPremiumLeading EdgeFuture
Rigid PCB technologiesYes
Flexible circuitsYes
Rigid-flex circuitsYes
Flex heaters / ribbon cablesYes
Thermal management / LED PCBs Yes
High speed digital PCBs Yes
RF/microwave/mm-wave PCBs Yes
Highest layer count24284040
Maximum board thickness (in mils)220235250300
Minimum board thickness (2 layer) (in mils)5432
Thinnest core material (rigid) (in mils)32.521.5
Thickest core material (in mils)125125125125
Largest panel size (in inches)18 by 2424 by 3024 by 3024 by 30
Maximum usable area (in inches)16 by 2222 by 2822 by 2822 by 28
Bow and twist -% (balanced)<0.75%<0.75%<0.75%<0.75%
Minimum copper to edge clearance (in mils)10855
Min. positional tol.-feature to feature (in mils)+/- 5+/- 4+/- 3+/- 2
Layer to layer registration tolerance (in mils)+/- 5+/- 4+/- 3+/- 2
Number of sequential lamination cycles2456
Hole to copper (internal plane layers) (in mils)10765
Drilled hole to drilled hole distance (in mils)141287
Inner layer lines and spaces (1/2 oz.)4322
Inner layer lines and spaces (1/4 oz.)4321.5
Outer layer lines and spaces (1/2 oz. base)4322.5
Outer layer lines and spaces (1/4 oz. base) 4322
Maximum aspect ratio-w/.010" drilled hole 10:120:130:135:1
Smallest drilled thru via 62 mil thick (in mils)8645
Smallest drilled thru via 93 mil thick (in mils)10865
Smallest drilled thru via 115 mil thick (in mils)121086
Min. pad width (in mils)8643
Min. pad spacing (mils)8643
Min. pad pitch (mils) 141086
Pad size over via size -Class 2 (in mils)10864
Pad size over via size -Class 3 (in mils)121088
Antipad over drill size (in mils)201687
Press fit hole tolerance (in mils)+/- 2+/- 2+/-1.5+/- 1
Back drilling tolerance +/- (in mils)10643
High Density Interconnect (HDI)
Smallest laser drilled vias (in mils)4322
Smallest pad size over drilled hole size (in mils)10743
Maximum aspect ratio-microvias0.8:11.2:11.5:12:01
Stacked/Staggered Micro Viasyesyesyesyes
HDI Constructions1+n+12+n+25+n+56+n+6
SMD soldermask web width (in mils) 3223
SMD soldermask clearance over pad (in mils) 4323
Soldermask registration tolerance (using film) 32.522
Soldermask registration tolerance (using LDI) 2.521.51
Controlled Impedance
Impedance control-single ended +/- %10%5%5%3%
Impedance control-edge coupled diff. +/-%10%5%5%3%
Impedance control-broad side differential +/-%10%5%5%3%
Laminate materials
Standard FR4Yes
Lead-free compatible FR4Yes
High speed digital materialsYes
RF / microwave materialsYes
Millimeterwave compatible materialsYes
Thermal management / LED board
Aluminum backed materialsYes
Thermal conductivity of 1.5 W/mKYes
Thermal conductivity of 2.2 W/mKYes
Thermal conductivity of 3.0 W/mKYes
Thermal conductivity of 4.0 W/mKyes
Thermal conductivity of 8.0 W/mKyes
Surface Finishes
ENIG (electroless Ni-immersion gold)Yes
ENIPIG (thin palladium <8 micro inchesYes
ENEPIG (thick palladium up to 24 micro inchesYes
Immersion SilverYes
Immersion TinYes
OSP - lead free compatibleYes
HASL (Tin/Lead) - verticalYes
HASL (lead-free) - verticalYes
Electrolytic hard goldYes
Advanced technologies
Copper plated shut micro viasYes
Single tier cavity designYes
Mixed dielectric designsYes
Edge plating / edge castellationsYes
Wrap plating (blind vias / filled vias)Yes
Laser defined soldermask printingYes
Embedded resistanceYes
Embedded capacitanceYes
Jump scoring capabilitiesYes
ITAR RegisteredYes

For additional information please contact us.